EVG®610
Supporting a range of standard lithography processes – including proximity, soft, hard and vacuum exposure modes – with its back side alignment options, the EVG610 provides additional functions such as nanoimprint lithography (NIL) and bond alignment. The EVG610 provides rapid processing and re-tooling for switching user requirements – the conversion time is under two minutes. In offering a multi user concept which can be adapted from novice to expert level, the EVG610 can be ideal for R&D and university applications.
Features
- Wafer/substrate size from pieces up to 200 mm/8’’
- Top-side and bottom-side alignment capability
- High-precision alignment stage
- Automated wedge compensation sequence
- Motorized and recipe-controlled exposure gap
- Supports the latest UV-LED technology
- Minimized system footprint and facility requirements
- Step-by-step process guidance
- Remote tech support
- Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
- Agile processing and conversion re-tooling
- Table top or stand-alone version with anti-vibration granite table
- Additional capabilities:
- Bond alignment
- IR alignment
- Nanoimprint lithography (NIL)
