The E400 E is a tool for the planarisation and polishing of single wafers with 1″ to 4″ diameters. It offers new carrier technology which expands the range to smaller sizes and products of varying shapes; including 10 x 10 mm squares and quarter of wafers. The E400 E is used best in research and development processes, especially in the development of new materials.
With its ten process steps and specific parameter sets, the E400 E enables manual loading and automatic polishing control which is operated through a user-friendly touch screen. Standard wafer mounting utilises back pressure and vacuum, and is also suitable for wax and template mounting. Carrier arrangements can be tailored to fit customer needs, and the tool provides an automatic conditioning device.