EVG®805

The EVG805 semi-automated debonding system is designed for temporary bonded and processed wafer stacks made up of a carrier wafer device wafer, and an intermediate temporary bonding adhesive. Both mechanical and thermal debonding can be supported by the tool, and thin wafer is typically unloaded on a single substrate carrier for secure transport between tools.

Features

• Open adhesive platform
• Debond Options:
• Thermal slide off debonding
• Lift off debonding
• Mechanical debonding
• Recipe controlled system  
• Real time monitoring and recording of all relevant process parameters
• Unique features for thin-wafer handling
• Various chuck designs to support wafer/substrates and carriers up to 300 mm
• High topography wafer handling