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EVG®560

The EVG560 is an automated wafer bonding system which is able to accept up to four bond chambers and several chamber configurations choices for any wafers and bonding processes up to 300 mm. This system incorporates the main features of the EVG manual bonding systems, and uses an identical bond chamber design, while offering enhanced automation and process control. The EVG560 provides high yield production bonds and possesses a robot handling system which loads and unloads process chambers automatically.

Features

  • Fully automated processing with automated loading and unloading of bond chucks
  • Up to four bond chambers for various bonding processes
  • Compatible with EVG mechanical and optical aligner including SmartView
  • Simultaneous rapid heating and cooling on top and bottom side
  • Automatic loading and unloading of bond chambers and cooling station
  • Remote online diagnostics