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EVG®520 IS

The EVG520 IS is a single chamber unit which is capable of handling wafers up to 200 mm – offering semi-automated operation which is suited for small volume production. The EVG520 IS has been redesigned, taking into account customer feedback and updated with EV Group’s technological innovations. The unit features a cooling chuck design and proprietary symmetric rapid heating. Among the benefits offered to wafer bonding processes by the EVG520 IS are high-pressure-bonding capability, independent bottom and top side heaters and the same process and material flexibility provided by manual systems.

Features

  • Fully automated processing with manual loading and unloading including external cooling station
  • Compatible with EVG mechanical and optical aligners
  • Single- or double-chamber automated system
  • Fully automated bond process execution and bond cover movements
  • Integrated cooling station for high throughput
  • Options:
  • High vacuum capability (1E-6 mbar)
  • Programmable mass flow controller
  • Integrated cooling